PackExpo, #packexpo, is a great show to see the latest technology available for packaging and packaging automation. It’s also a great place to learn more from key industry leaders. In this blog, we’re going to do something that we don’t normally do – we’re going to promote some companies who we think have some really cool technology or interesting insights in using technology to make their business run more efficiently or to reduces costs.
Here we go:
Accelerating Innovation through Collaboration presented by Holly Dunnill and Tashi Tiwari from Dow Chemical.
November 8| 11:00 AM – 11:30 AM | Innovation Stage | Booth N-4560
This presentation will offer a high-level overview of Pack Studios by Dow and relate how this exciting concept is re-shaping perceptions around the world regarding the collaborative process. Hear how Dow is engaging the entire value chain to “collaborate to innovate” and accelerating the commercialization of new products.
Aligning Consumer Trends with Packaging Innovation presented by Virginia Murray.
November 6| 1:00 PM – 1:30 PM | Innovation Stage | Booth N-4570
As a result of a non-stop evolving world, a number of new consumer trends have emerged, making consumers reevaluate their priorities and continuously ask themselves what they really value. Being able to identify such trends and translate them into packaging features is key to align packaging innovation to consumers’ expectations.
Innovations in Primary Packaging presented by Richard Peloquin and Jackson Shulman from 3M.
November 7| 11:00 AM – 11:30 AM | Innovation Stage | Booth N-4580
3M will walk you through its insights into the primary market and how the company is utilizing these insights to develop unique solutions in the market.
Smart Packaging – What’s the Reality? presented by Tricia Sime from Inland and Joao De Oliveira from ParagmatiC
November 9| 12:00 PM – 12:30 PM | Innovation Stage | Booth N-4580
As markets continue to see advances in interactive packaging, this sessions aim to answer the question most brands are asking – what’s the reality? We’ll cover what smart packaging development consists of – including project scope, key partnerships and what your supply chain needs to make your product “smart”.
Be the Disruption: Create Packaging that Wins in eCommerce presented by Brad Rager from Bemis Company, Inc.
November 7| 12:00 PM – 12:30 PM | Innovation Stage | Booth N-4570 PACK EXPO International
eCommerce is the next frontier for CPG’s. Companies are finding that existing packaging solutions, honed over decades for retail, do not align with the rigors of the eCommerce distribution chain, have unsustainable economics or have shortchanged the consumer experience. Explore the opportunity for packaging to unlock breakthrough growth in eCommerce.
Evolution of Line Productivity – PackML, Industry Standards, and the Industrial Internet of Things presented by Bryan Griffen and Frank Volpe from Nestle Corporate Engineering
November 7| 3:00 PM – 3:30 PM | Innovation Stage | Booth N-4560
Do you know the latest technology standards and initiatives to improve productivity, OEE, and Total Cost of Ownership? The convergence of industry standards offers new opportunities to leverage consistent machine-to-machine communication and data capture.
Insights on Global Packaging Trends presented by Denise Greenwell from Berry Plastics.
November 8| 2:00 PM – 2:30 PM | Innovation Stage | Booth N-4570
Consumers are changing at a pace never seen before – and their packaging needs and expectations are changing just as rapidly. Learn what’s influencing your consumers from food to pharma, household care to personal care, and everything in between.
Cloud-Connected Industry Powers Continuous Improvement presented by Daymon Thompson from Beckhoff Automation
November 8| 1:00 PM – 1:30 PM | Innovation Stage | Booth N-4570
As exciting concepts for IoT and Industrie 4.0 continue to rise, there are now truly enabling technologies and tools available to rise with them. This educational presentation will provide information on practical IoT and Industrie 4.0 solutions that are within reach today and worthy of your time and investment.
How the Industrial Internet of Things (IIoT) Provides a Critical Competitive Edge in Manufacturing presented by Paul Boris and Reid Paquin from GE Digital.
November 7| 10:00 AM – 10:30 AM | Innovation Stage | Booth N-4560
The use of data to drive real-time operational decisions is changing how manufacturers look at their equipment, business models and ultimately how they deliver safer products and better outcomes for customers and end users. And they do all of this while taking significant cost out of operations.
Managing the DNA of Packaging Specs Intelligently to Drive Cost Reductions and Business Efficiencies presented by Matthew Wright, Founder and CEO for Specright.
November 7| 2:00 PM – 2:30 PM | Innovation Stage | Booth N-4560
Packaging specifications are the DNA of value chains. Accurate specs enable the chain to function faster and effectively, while inaccurate specifications impact logistics, transportation, speed to market, responsiveness to recall/failure, etc. Learn how to effectively manage the DNA of packaging specifications to drive cost reductions/efficiency across your value chain.
For more sessions be sure to check out PackExpo Sessions. We’re sure you’ll find something interesting!
#packexpo, #automation, #specs, #packagingspecification, #packagingsoftware. #Internetofthings, #cloud-based, #smartpackaging, #primarypackaging, #collaboration
Rebecca Janzon is Marketing Manager for Specright. She has 20+ years in experience in the areas marketing/communications/PR working in marketing roles at SKF, Atlas Copco, Nobel Biocare and Cochlear. She brings a wealth of knowledge in SaaS, engineering services, computer software, and packaging.